India is now the fastest growing photovoltaic (PV) market, knocking Britain into fourth place.
That’s according to a Trendforce Energy Trend report, which said that the Chinese PV industry exported 12GW of modules during the first half of this year, of which 6GW went to Japan, the US and India.
International disputes over PV production will not stop both China and Taiwan to create additional manufacturing capacity for modules.
China had been hit by tariff impositions and that’s caused retaliation from the country, which has imposed high tariffs on US and European polysilicon companies.
American and European companies are likely to reduce their capacities because of the import barriers China has placed on them.
Many companies, said Energy Trend, are looking to establish PV production facilities in India as it is such a bouyant market.
The competitive nature of the market is, the analysts warn, likely to cause consolidation and strategic alliances in the short term.
Here’s Trendforce Energy Trend’s map of Chinese module exports.
DDR3 will hold its position as the leading technology in 2011’s DRAM market for at least three years before an evolution into the next generation.
According to IHS iSuppli, DDR3 will make up 89 percent of all the 808 million DRAM module units shipped in 2011. It has quickly become the dominant technology in the segment, holding 67 percent of units shipped for 2010 and 24 percent in 2009.
DDR2 will still be floating about, accounting for just nine percent of 2011’s module market. Last year it managed a respectable but weakening 29 percent. It was at the top of its game for about four years before DDR3 became the attractive option. The rest of the DRAM market will be legacy DDR.
DDR3 will keep its grip during the years to come, with shipment levels expected to reach as high as 94 percent of the whole market in 2013. 2014 will see its cycle slow and reach the inevitable decline. IHS iSuppli’s research points to DRAM module density reaching 8 GB from just 1 GB in 2009.
2014 will see DDR4 making in-roads into the market with projections sitting at 12 percent market share. In 2015, DDR4 will have already taken the lion’s share at 56 percent. DDR2, DDR3, DDR4 – seems like a reasonable progression to us.
Meanwhile, in the enterprise channel, LRDIMM – or Load-reduced Dual In-line Memory Modules – are just about ready to make their appearance in high performance servers, running at higher densities of 16GB. They will offer a significant boost to the memory of enterprise servers and mainframes, getting around problems like signal integrity degradation and performance woes that come with high memory densities.
Though LRDIMMs will be handy for continued loading, as well as increases in megabyte capacity for speciality systems, they won’t be compatible with older machines.
Kingmax, a supplier of high-performance memory modules, has lifted the kimono on “invisible heat-spreaders” which it has been developing.
Obviously, if something is invisible you can’t actually see it, but we will take Kingmax’s word that there is a new method of taking heat from memory modules for us to see.
Kingmax suggests that if you cover the chips and modules with a “special compound”, which is invisible, you can reduce the heat of memory chips.
Its invisible Nano Thermal Dissipation technology will be seen on Kingmax’s 2.40GHz dual-channel DDR3
To be fair, there is technology there, it is just that it is Thursday and we have not had our second cup of coffee yet. The Nano Thermal Dissipation Technology (NTDT) is made up of nano-size silicone. This compound that fills up the invisible vacant space of the smooth surface to remove the surface heat more quickly. Kingmax said that the compound acts like a sponge that pulls the heat from memory chips operating at rather high 2.40GHz clock-speed and releases it into the air at a faster rate than a normal product would do itself.
The outfit also thinks that the compound could be mixed into the resin for product packaging; it would bring a better thermal dissipation result than just covering the surface of chips.
There are some substances on the market that may speed up spreading of heat, however they are widely seen as been inefficient.
Kingmax assures us that DRAM modules featuring NTDT have 2°C lower temperature compared to non-NTDT modules. Not really turning the chips into a fridge. However Kingmax’s latest 4GB DDR3 dual-channel memory kit does have some impressive specs which seem to hint that there is something there doing something good. It has a 2400MHz clock-speed with CL10 at 1.5V – 1.8V voltage setting.