Japanese firms partner for multi-standard mobile modem

A multi-standard modem has been developed by a group of Japanese electronics firms: DoCoMo, NEC, Fujitsu and Panasonic.

The companies teamed up to work on a modem that covers a variety of standards without requiring multiple chips to be housed in a mobile device.

Jointly working on the hardware and software’s intellectual property, the group came up with a a chip that will serve GSM, W-CDMA, HSPA+ and LTE standards.

With the transition to 4G connectivity in full swing, unless you are in Britain of course, the chip will make the jump less painful by catering for all needs.

By only needing to use one chip to ensure that a mobile device is able to connect to different networks, which could be a problem for business users abroad, there are efficiency bonuses in terms of power.

By operating on a single chip, power consumption is said to have been reduced by 20 percent when in use, as well as when on standby. Furthermore, there are inevitable reductions in costs by housing everything in one place.

However, the group noted that the standard for LTE Advanced is not currently part of the deal, though they are currently looking at technology that would allow for its development.

Testing for all major networks has now been completed, and the partners hope to begin commercialisation in Japan.

DoCoMo has been developing wireless technologies alongside other partners too, striking an agreement with Jasper Wireless to connect machine-to-machine (M2M) devices with consumer electronics.

The pair will look to create a new category of embedded wireless devices, with a likelihood of automotive applications in Japan.