The advancement has been possible by reviewing circuit design, meaning that Renesas has been able to significantly enhance performance while still managing to ensure that the CE150 chip would be able to fit inside a smartphone.
According to an announcement via Nikkei (subscription needed) the new chip will also be able to offer faster processing speeds, with continuous shots being possible at five times the current speed.
The chip will also allow full-high-definition video images due to a low power data transmission standard.
“The CE150 makes it possible to achieve high-speed continuous image shooting, which is demanded in high-end cameras offering top picture quality,” the Japanese firm told TechEye. “At the same time it features high-speed enhancements and a two-lane MIPI® CSI-2 high-speed output interface from the camera to the mobile phone application processor.”
“In addition, advances in noise-reduction technology realise the industry-leading high-quality image processing by pairing the CE150 with a 16-megapixel CMOS image sensor.”
Mass production by Renesas will begin in March, with an estimated 1 million chips being manufactured per month though Renesas declined to comment as to who will be using the chip.
According to Renesas the number of smartphone cameras with five megapixels or higher are expected to reach more than 400 million by the end of the year.