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Latest Renesas news
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Renesas ties up with TSMC
Troubled Japanese chipmaker Renesas Electronics has signed a pact with TSMC in a bid to keep up with its competition while it is suffering from heavy losses. -
Intel's Ivy Bridge delayed - report
One group that will be happy are the USB 3.0 chipmakers such as Renesas, ASMedia and Etron allowing them to earn an extra quarter of sales. -
Renesas, Fujitsu and Panasonic to merge chip operations
Three chip makers, Renesas, Fujitsu and Panasonic, have decided that the only way they can compete is by merging their operations. -
Semiconductor industry heads to Mount Doom
Some of the major players are stopping the industry from falling into a slump. Though plenty Q4 projections are pessimistic, companies like Intel, Samsung, Renesas, Qualcomm and AMD all think the last quarter will be strong enough, in turn saving the market from drooping or stagnating. -
Intel and friends working on USB power source
Intel's involvement is interesting considering how long it dragged its heels on integrated USB 3.0 chips, compared to AMD. Anyway, along with Microsoft, what is left of HP, Renesas Electronics, ST-Ericsson and Texas Instruments, Intel will introduce the technology to the USB Implementers Forum in ea -
SIA finally releases semiconductor fab capacity report
“Either then the fab is never reopened (Freescale) or comes back active (Renesas) and the capacity jumps back up again, albeit not to the same level. -
Scrimping hard disk manufacturers not helping supply shortage
This is despite the likes of Texas Instruments and Renesas Electronics both working hard to get their supply back on track. -
Tablet, chip and car component shortages continue post-quake
USB 3.0 chips are another source of concern with short supply at Renesas likely to be offset by production moving to Taiwanese suppliers. -
Chip revenues up 30 percent to $300 billion in 2010
However Rohm, Renesas, Nvidia and MediaTek trailed market expectations by 10 percent. -
Supply of worldwide semi wafers is in deep jeopardy
Japan's earthquake and tsunamiRenesas, too, is suffering from the effects of the earthquake, said IHS iSuppli – and is only able to produce 40 percent of its wafer capacity, while half the wafer capacity at Fujitsu has been damaged. Fujitsu is estimating it will take between three or four weeks to start production again. -
Some fabs reopen in Japan
Japan's earthquake and tsunamiOne company is Renesas Electronics, which had a number of production facilities affected by the the earthquake. As well as already restarting production at two facilities north of Tokyo the company has announced plans to restart another five facilities, which were shut down last week. -
Aftershocks mean Japanese semi production stalled
Japan's earthquake and tsunamiRenesas Electronics -
Toshiba renews Rambus licence
Other licensees include Renesas, AMD, Sony, Panasonic, Samsung, Elpida, Intel and others. Rambus has a reputation for fierce litigation and has conducted many lengthy court cases to establish that it does own a heap of memory patents. -
ARM shares rise as it looks to LTE
MWC 2011Members of ARM’s Partner Community, which includes Samsung, Renesas Mobile, Qualcomm and others also highlighted the importance that ARM has to play in the move to the next generation of mobile devices. -
Toshiba eyes up GlobalFoundries for outsourced chips
GlobalFoundries already has an outsourcing deal with Renesas Electronics and hopes to expand its Japanese business by supplying chips to more companies in the region. -
TSMC increases R&D spend by nearly 50 percent
This increase secured it the tenth spot on the list, beneath a number of other big names who have been spending big time on research lately. Intel topped the list, with Samsung and STMicro taking second and third slots respectively. -
Renesas chip allows 16 megapixel smartphone cameras
Renesas Electronics has announced the development of a new high performance image processing chip which will enable smartphone camera resolutions to 16 megapixels. -
Gigabyte announces Mini-ITX motherboard with AMD Fusion support
CES 2011Other features include an On/Off Charge for quick charging of devices like smartphones and tablets, 3x USB Power Boost and an onboard Renesas NEC controller for USB 3.0. When coupled with an AMD processor and graphics card it supports Blu-ray and high-definition 7.1 surround sound.
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