Qualcomm, TSMC unveil 28nm HPM chips

Qualcomm and TSMC are teaming up to produce silicon on TSMC’s High Performance Mobile process technology, which they boast can support 2GHz+ application processors at low power.

That sort of power consumption on a chip means Qualcomm will be going for its established position in the market – smartphones and tablets. The first device made with 28 HPM will be the Snapdragon 800 with quad core Krait 400 CPUs.

Qualcomm promises speeds of up to 2.3 GHz per core making the chip a formidable contender. It is the first SoC of its sort that integrates a 4G LTE Advanced modem with carrier aggregation and category 4 data speeds of up to 150 Mbps, the company says.

According to the companies, this process can manage CPU speeds of between 2 and 2.3 GHz using under 750mW of power consumption per core, which is half the power of TSMC’s 40LP devices.

In a statement, executive veep at Qualcomm Technologies, Jim Lederer, said the chip should give the company even more of an edge in smartphones and tablets. TSMC North America president, Rick Cassidy, said it is Qualcomm’s “deep familiarity with 28nm design” that helped the company “achieve breakthrough 2.3GHz performance and power characteristics” that users are after these days.