Kingmax, a supplier of high-performance memory modules, has lifted the kimono on “invisible heat-spreaders” which it has been developing.
Obviously, if something is invisible you can’t actually see it, but we will take Kingmax’s word that there is a new method of taking heat from memory modules for us to see.
Kingmax suggests that if you cover the chips and modules with a “special compound”, which is invisible, you can reduce the heat of memory chips.
Its invisible Nano Thermal Dissipation technology will be seen on Kingmax’s 2.40GHz dual-channel DDR3
To be fair, there is technology there, it is just that it is Thursday and we have not had our second cup of coffee yet. The Nano Thermal Dissipation Technology (NTDT) is made up of nano-size silicone. This compound that fills up the invisible vacant space of the smooth surface to remove the surface heat more quickly. Kingmax said that the compound acts like a sponge that pulls the heat from memory chips operating at rather high 2.40GHz clock-speed and releases it into the air at a faster rate than a normal product would do itself.
The outfit also thinks that the compound could be mixed into the resin for product packaging; it would bring a better thermal dissipation result than just covering the surface of chips.
There are some substances on the market that may speed up spreading of heat, however they are widely seen as been inefficient.
Kingmax assures us that DRAM modules featuring NTDT have 2°C lower temperature compared to non-NTDT modules. Not really turning the chips into a fridge. However Kingmax’s latest 4GB DDR3 dual-channel memory kit does have some impressive specs which seem to hint that there is something there doing something good. It has a 2400MHz clock-speed with CL10 at 1.5V – 1.8V voltage setting.