Busy bee Intel has said it will support USB 3.0 in 2012, integrating it into its Ivy Bridge chipsets.
Now that it’s come out, it wants developers to being to target this technology along with Thunderbolt.
Kirk Skaugen, vice president at Intel Architecture Group, told delegates at a developer conference in Beijing that this is because the technologies complement rather than compete with each other.
Now it looks as though the feature will become more widespread as Intel plans to incorporate it into its Ivy Bridge chip family, which will follow Sandy Bridge. Intel wants others to play along, hoping for USB 3.0 and Thunderbolt to find its way into printers, scanners and cameras etc.
Intel has also announced that it has teamed up with Micron. Together the pair have created a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory.
The new process means that it can produce an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, which gives users a high-capacity, teeny tiny storage device for saving music, video, books and other data on smartphones and tablet.
Intel claims there’s a 30 to 40 percent reduction in board space compared to its existing 25nm 8GB NAND device.