Like we reported earlier, Globalfoundries is pinning its hopes on HKMG – the beast it claims to have tamed – now and around the future, and it has plans for 20nm, 14nm and 450mm processes which are around the corner, but some are less around the corner than others.
Fab1 in Germany is running on 45nm and below, with claims from Glofo that it shipped more HKMG than any other foundry in the industry. Capacity is set to ramp up to 80,000 a month. Fab 7 in Singapore goes from 130nm down to 40nm, and there will be additional 40nm capacity on the way. At the moment the overall capacity is 50,000 wafers per month.
“My baby,” says Globalfoundries’ Norm Armour, “fab 8 in upstate New York is targeted for 28nm and below, the initial will be 32 SOI, followed shortly by 28m”, and the production ramp will begin in Summer 2012. The NY fab, which Glofo is claiming to be “the world’s most advanced,” has an awful lot of cleanroom space – six American football fields worth, Armour says.
Again, those without sin did not cast the first stone, with Glofo calling out TSMC and UMC on their 300mm operations. Glofo says it’s close to a million wafers capacity overal in 300mm, which it claims is above the combined capacity of TSMC and UMC.
Samsung and Globalfoundries’ joint announcement, which hit the wires first thing today, was not given much time. Probably around 5 minutes all-in, but Samsung did get a promo video out of it.
Analysts claim the 450mm transition is going to be risky, but Globalfoundries says it is “inevitable”. It expects between 40-45,000 wafers a month.
Gregg Bartlett, technologies and development, reckons he has the coolest job in the company. He revealed to the room that Glofo’s HPC 20nm SHP will arrive in 2014. The 28nm will turn up in 2012. For the wired and networking segment, the 28nm HPP is around the corner in 2012, while 20nm LPM should arrive in 2013.
The new offering is 28nm LPH, Bartlett says, which he says fills a “critical gap” in the industry for customers after high performance in mobile but are also interested in decent power levels. Same with 20nm, but there’s a move towards a “single platform in both the mobile and networking space.”
Again, Globalfoundries took aim at rivals. The 20nm LPM beats the 20nm SOC of “a competing foundry” and “a CPU manufacturer’s” 22nm SOC in low power, mobile high performance, and high performance wired.
There was some talk of 14nm and beyond, with Bartlett mentioning FinFET. Like we said earlier, Globalfoundries is also interested in advanced packaging, source mask optimisation, and it isn’t going to ignore 3D entirely. Though at a press conference it claimed Intel should be careful about jumping the gun on less mature technologies, it eventually conceded that Intel will probably be able to get around the challenges it may face. Glofo’s 3D innovation time line sees 2015 penned in for 3D IC packages.