Dutch semiconductor equipment maker ASML said that one of its subsidiaries will collaborate with Globalfoundries in an effort to accelerate the development of future nodes.
Brion Technologies will work with GloFo to deliver high volume computational lithography capabilities for 20nm and 28nm tapeouts. ASML’s approach to holistic lithography, it is claimed, can enable both process window enhancement and process window control from design to mask tapeout to chip manufacturing. It argues it can do this by leveraging the putational model accuracy from tight integration with the ASML scanners including FlexRayTM & FlexWaveTM.
“At 28nm and below it is necessary to explore and realize every possible process window improvement to achieve a manufacturable patterning solution,” said Globalfoundries senior fellow Chris Spence. “We have found that Brion’s OPC and Computational Lithography solutions enable us to achieve this goal and ensure the best possible yield for Globalfoundries’ customers.”
Jim Koonmen, general manager of Brion Technologies said the new technologies will be used in future notes, including 14nm.