AMD launch first embedded APU processor

AMD has announced the availability of its Embedded G-Series processor, the first Accelerated Processing Unit (APU) for embedded systems. 

Using Fusion technology the new processor is said to incorporate the new low power x86 CPU, based on AMD’s ‘Bobcat’ core.  Also featured is a DirectX11 enabled GPU and a parallel processing engine, all on a single piece of silicon, offering cutting edge 3D and graphics processing.

The processor will also enable power management features including C6 and power gating, and DDR 800-1066 memory.

AMD claims that this new class of accelerated processor combines more computed capabilities on a single die than any other processor in the history of computing, offering opportunities for major advancement in embedded systems, something one Dirk Meyer would have been rather proud of had he still been at the firm’s helm for this announcement.

AMD claims it was its mission to lower power, shrink physical component area, and reduce the costs of designing and producing x86 embedded systems.

“AMD’s commitment is to ensure the game-changing technologies we develop for consumers and the enterprise are also available for the vast and growing embedded market,” said Patrick Patla, corporate vice president and general manager, Server and Embedded Division, AMD.

“Today, we have a record number of embedded launch partners. They are using the unique advancements of the AMD Embedded G-Series APU to develop a brand new generation of highly differentiated, energy-efficient, small form-factor embedded systems that can deliver the vivid visual experience expected in our always-connected world.”

It is estimated by Shane Rau, research director of Computing and Storage Semiconductors at IDC, that shipments of processors for embedded systems to increase at a double digit rate each year for the next five years.

AMD Embedded G-Series APU full specifications.

 – 1 or 2 x86 “Bobcat” CPU cores with 1MB L2 cache, 64-bit Floating Point Unit
 – Up to 1.6GHz
 – 9W and 18W TDP
 – Array of SIMD Engines
 – DirectX(R) 11 capable graphics
 – Industry-leading 3D and graphics processing
 – 3rd Generation Unified Video Decoder
 – Power management features, including C6 and power gating
 – DDR3 800-1066 memory with support for 64 bit channel and 2 DIMMs
 – Ball Grid Array (BGA) package
 – 890mm(2) physical footprint, including the AMD Fusion I/O Controller Hub