AMD hands extra Fusion chip production to TSMC

AMD appears to be throwing production contracts over to Taiwan Semiconductor Manufacturing Co for its Fusion chips.

It had been expected that AMD ship five million chips of its C and E families of APUs, but due to excessive demand AMD has had to call in a second source for its production.

This means it has turned to TSMC rather than GloFo to deal with the extra production.  It is reported that AMD will be chucking the work on its Desna tablet chips over to TSMC too as it expands its APU range.

Better than expected sales of its APUs has meant that it can up its revenue expectations for the third quarter after large shipments in the second quarter.  This means a rise to between 8-12 percent, higher than the 8 percent median expected by the industry.

The contracts will see rollouts of updated versions of the C and E series, codenamed Ontario and Zacate, writes CENS.  The ranges will be aimed at squarely at the boom in mobile computing, and so ultrabooks and netbooks, as well as use in all-in-one desktops.

The new chip families will feature improved high definition graphics and memory, and will support DDR3 1333MHz memory chips meaning ability to upgrade video display quality.

Power efficiency management will supposedly allow 12 and 10.5 hours of charge for the C and E processors respectively.