AMD dumps SOI sauce

AMD has finally admitted that Intel was right when it came to the SOI manufacturing process.

Chipzilla has not used Silicon on Insulator (SOI) technology for nearly 30 years.

SOI is the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates.

AMD used the technology on its 130nm, 90nm, 65nm and 45nm single, dual, quad and six core processors since 2001. Intel announced it will not go to SOI at 22nm due to costs, and instead will use tri-gate technology.

Now it seems that AMD has to admit that Intel was right and it will not use SOI wafers for the 28nm node.

Thomas Seifert, AMD’s CFO, told Electronics Weekly that on 28nm, all of its products will be bulk and there is no room for SOI processes.

He pointed out that Intel has flirted with SOI for several decades but has never used the technology for mainstream product manufacturing.

The technology was developed in the 1990s. Intel and HP co-developed SOI technology at HP’s Palo Alto ULSI laboratory, but it was never adopted for commercial products.

About 10 years ago Intel announced a ‘TeraHertz’ transistor which was a fully depleted SOI transistor but, although Intel has developed its own variant of SOI, it never used it.