Globalfoundries leaves AMD's nest, completely

In what is being spun, by us, as “independence day”, Globalfoundries has acquired the rest of its shares from AMD – on its third anniversary of spinning off.

According to the company, the announcement fulfils the company’s long-term vision of becoming an independent foundry company. It also brings to an end AMD’s financial involvement in the company, so it is fairly likely GloFo is not the only one which is celebrating.

The fabless chipmaker’s dissatisfaction with its former spin off has been getting more public after there were delays in getting some of AMD’s more cutting edge chips into the shops last year. AMD has reportedly been talking to some of Gloflo’s rivals about future products.

The announcement, which has been made as an amendment to the commercial Wafer Supply Agreement (WSA), still means that AMD is “one of the company’s primary and strategic customers”. GloFo will now be wholly owned by the Advanced Technology Investment Company (ATIC).

GloFo CEO Ajit Manocha said that it marks a new era for Globalfoundries as it becomes a truly independent foundry. He said that GloFo still wanted to be the leading semiconductor foundry partner to AMD and one of the world’s top technology companies.

Manocha added that AMD’s 32nm processor shipments increased by more than 80 percent from the third quarter to the fourth quarter and now represents a third of AMD’s overall processor mix.

He said GloFo was the the only foundry to have shipped in the hundreds of thousands of 32nm High K Metal Gate wafers.

Earlier this year, the company announced that its newest 300mm manufacturing facility, Fab 8 in New York, started running the first silicon as part of a new customer agreement to develop leading-edge chips for IBM.

However he also highlighted several significant milestones in its partnership with ARM, including the industry’s first Cortex-A9 processor operating at more than 2.5GHz on 28nm high-performance technology, and the first 28nm ARM Cortex-A9 Processor Optimization Pack (POP) capable of up to 2GHz on a low-power process geared toward smartphones and other mobile applications.